SisuSemi has partnered with IPG Photonics, the world leader of fiber laser technology, to introduce a breakthrough Ultra‑High‑Vacuum (UHV) wafer cleaning system that pairs atomic‑level cleanliness with a first‑of‑its‑kind laser‑based wafer heating technology. The system supports wafer sizes up to Ø300 mm, with full flexibility to process Ø200 mm and Ø150 mm wafers, unlocking new levels of wafer purity for the most advanced semiconductor nodes. This solution is part of SisuSemi’s ALP (Atomic‑Level Purification) technology platform, engineered to deliver unmatched wafer surface quality for advanced semiconductor manufacturing.

Uniform wafer heating is foundational to many semiconductor manufacturing technologies.

With the SisuSemi’s patented ALP solution – using uniform heating, UHV and controlled oxidation – the solution directly addresses one of the most critical bottlenecks in the semiconductor industry: surface and interface defects and contaminants. In advanced nodes, interface contamination and defect density are among the primary causes of leakage current, threshold voltage instability, and yield loss. As devices move towards smaller node sizes, traditional cleaning and thermal treatments can no longer ensure the atomic‑level surface quality required for reliable device performance. A remote laser heating solution enables contamination control because the laser beam delivery optics are outside the UHV process chamber.

When designing its next‑generation UHV cleaning platform – called AtomSeal – SisuSemi evaluated multiple heating methods before selecting laser heating based on its attributes for uniformity, repeatability, and throughput scalability.

SisuSemi’s CTO Elmira Jahanshah Rad: “When we designed our wafer solutions, we weighed traditional resistive heating and laser heating. Laser heating provides uniformity and throughput scalability that are crucial for scaling SisuSemi solution to large volume manufacturing”.

IPG Photonics’ laser heating system delivers highly uniform heating across the full Ø300 mm wafer area, the global industry standard. Combined with SisuSemi’s ALP UHV cleaning process, we can now support state-of-the-art R&D and low volume fabs with atomic-level cleanliness in semiconductor industry for wafer sizes up to Ø300 mm. Fiber delivery allows the laser’s power unit and utilities to be positioned outside the cleanroom. Only the optical head at the distal end of the fiber delivery is near the process chamber, saving valuable cleanroom space while simplifying equipment integration and service.

The AtomSeal complete system is now commissioned in SisuSemi cleanroom, able to serve Front-End-of-Line processes for foundries and IDMs working on advanced CMOS, photonics, and MEMS — especially 3 nm and below — targeting applications in edge computing, IoT, AI, and high-frequency devices. The ALP process is also applicable to conventional technologies, where atomic-level cleanliness can reduce power consumption and increase production yield. The ability of laser to uniformly heat over a large area multiplies the treatment capacity of diced chips in the Back-End-of-Line to deliver side wall passivation directed at reducing leakage current and dicing induced yield losses, providing proven benefits for sensors and detectors.

SisuSemi’s roadmap includes scaling ALP to high‑volume manufacturing tools with seamless integration into 300 mm production lines. This and future generations of SisuSemi’s AtomSeal systems are engineered to fit into existing fabs as either pre‑ or post‑treatment steps, without breaking vacuum.

Andrey Mashkin, Vice President, GM Global Lasers: “Combining our laser heating solution with SisuSemi’s UHV based atomic-level cleaning enables new standards in wafer quality while accelerating IPG’s vision for the sustainable Fab. Laser heating is fast, clean and efficient, with minimal service and consumable requirements.”

SisuSemi CEO Erkki Seppäläinen: “This partnership transforms how fabs approach wafer cleanliness — beyond conventional limits.”

About SisuSemi Oy:

Founded in 2024 and based in Turku, Finland, SisuSemi Oy specializes in silicon-based semiconductor surface cleaning at the atomic level. Leveraging over 10 years of research from the University of Turku, SisuSemi is dedicated to improving chip quality and performance through innovative and sustainable technology solutions that empower manufacturers to push the boundaries of performance.

For more information, see SisuSemi web page: www.SisuSemi.com  

Erkki Seppäläinen

CEO, Co-founder, SisuSemi 

erkki@sisusemi.com 

+358 40 7687591

The post SisuSemi utilizes IPG Photonics Laser Solution to revolutionize the semiconductor industry appeared first on SisuSemi.

Turku, Finland – August 29, 2025 

We are proud to announce that SisuSemi has recently secured national patent grants in Japan, Taiwan, and through the European Patent Office (EPO), marking a significant milestone in the expansion of our international intellectual property portfolio. 

These newly granted patents reinforce our commitment to pioneering innovation in semiconductor surface cleaning and interface technologies. The approvals span across multiple patent families, reflecting the novelty and global relevance of our solutions. 

• Japan: Japan’s grant highlights the technological strength and industrial applicability of our innovations. 

• Taiwan: As a key hub in the semiconductor supply chain, Taiwan’s acceptance further validates our strategic importance in the region. 

• EPO: The European Patent Office’s approval ensures broad protection across multiple European markets, supporting our growth and collaboration opportunities within the EU. 

“These patent grants in Japan, Taiwan, and Europe validate the novelty and industrial relevance of our core technologies in advanced surface preparation and interface engineering,” said Erkki Seppäläinen, CEO of SisuSemi. “Securing IP protection in these strategically important geographies strengthens our ability to commercialize proprietary solutions globally and supports our long-term roadmap for enabling next-generation semiconductor manufacturing.” 

These achievements not only protect our core technologies but also empower our partners and customers with cutting-edge solutions backed by strong IP rights. We look forward to continuing our journey of innovation with confidence and global reach. 

Stay tuned for more updates as we continue to push the boundaries of semiconductor technology. 

About SisuSemi Oy: Founded in 2024 and based in Turku, Finland, SisuSemi Oy specializes in silicon-based semiconductor surface cleaning at the atomic level. Leveraging over 10 years of research from the University of Turku, SisuSemi is dedicated to improving chip quality and performance through innovative technology solutions.  

For more information, see SisuSemi web page: www.SisuSemi.com    

Erkki Seppäläinen  

CEO, Co-founder, SisuSemi   

erkki@sisusemi.com   

+358 40 7687591  

The post SisuSemi Strengthens Global IP Portfolio with New Patent Grants in Japan, Taiwan, and Europe  appeared first on SisuSemi.

Turku, Finland – March 14, 2025

SisuSemi Oy, a pioneering deep tech company founded in 2024 and based in Turku, is set to transform the semiconductor industry with its innovative silicon-based surface cleaning technology. This breakthrough, developed over a decade of research at the University of Turku, promises to significantly enhance surface quality, enabling higher density chip designs and improving overall chip performance. SisuSemi changes the focus from particle level cleanliness to atomic-level cleanliness. As component size decreases and node width in state-of-the-art microchips is 2 nm, which is merely 20 atoms thick, atomics-level cleanliness has become a limiting factor to keep Moore law valid. 

SisuSemi’s atomic-level cleaning technology addresses critical challenges in semiconductor manufacturing by decreasing surface defects and leakage current. This advancement is poised to be a game changer, offering unparalleled improvements in chip quality and reliability. 

“We are thrilled to introduce this cutting-edge technology to the market,” said Erkki Seppäläinen, CEO of SisuSemi Oy. “Our research has shown that our surface cleaning process can dramatically improve the performance and efficiency of silicon-based semiconductors, paving the way for more advanced and powerful electronic devices.” 

Key benefits of SisuSemi’s technology include: 

• Enhanced surface quality for higher density chip designs 

• Reduction in surface defects 

• Improved chip performance 

• Decreased leakage current 

SisuSemi Oy is committed to driving innovation in the semiconductor industry and looks forward to collaborating with industry leaders to bring this revolutionary technology to the forefront of electronic manufacturing.

SisuSemi is grateful for the funding of Finnish Butterfly Venture Fund IV, NSI Nordic Science I, Monttu Ventures, Swedish BVF Venture Fund IV, Danish PSV Hafnium Fund I and European Investment Fund. Additionally, Business Finland supports the development and commercialization of the solution.  

About SisuSemi Oy: Founded in 2024 and based in Turku, Finland, SisuSemi Oy specializes in silicon-based semiconductor surface cleaning at the atomic level. Leveraging over 10 years of research from the University of Turku, SisuSemi is dedicated to improving chip quality and performance through innovative technology solutions. 

For more information, see SisuSemi web page: www.SisuSemi.com   

Erkki Seppäläinen 

CEO, Co-founder, SisuSemi  

erkki@sisusemi.com  

+358 40 7687591 

The post SisuSemi Oy Secures over €1 Million in Pre-Seed funding to Revolutionize Semiconductor Industry with Groundbreaking Surface Cleaning Technology   appeared first on SisuSemi.