New BEOL-compatible AtomSeal process unlocks up to $25M annual value per product line for semiconductor sensor manufacturers — without front-end redesign.

SisuSemi (www.sisusemi.com), the leading provider of Atomic Level Purification (ALP™) solutions, announced today a significant advancement in its process portfolio: a Back-End-Of-Line (BEOL)-compatible ALP™ process called AtomSeal, operating at a temperature of 200 °C (about 392 °F). This innovative solution directly addresses one of the most common issues affecting semiconductor manufacturing: leakage current.

Leakage current is a critical limiting factor in terms of yield, reliability and average selling price (ASP) across all types of semiconductor sensors including CMOS image sensors, LiDAR/ToF sensors, MEMS devices, RF/IoT, gas and temperature sensors. Previously, any effort to address this challenge was restricted by BEOL thermal budgets, which limited the application of standard surface treatment techniques that require higher temperatures above 350 °C.

At a temperature of 200 °C, SisuSemi achieved a 58% improvement in leakage current on third-party sensor components and 72% lower leakage current variability (standard deviation).

SisuSemi’s new low-temperature ALP™ process — validated on third-party commercial sensor components without device-specific optimization — delivered a 58% median reduction in leakage current and a 72% reduction in leakage variability (standard deviation). The drastic decrease in device-to-device variability means a direct improvement in calibration efficiencies, increase in yields, better binning results and enhanced reliability, all achievable post-dicing of the finished sensors.

From the financial standpoint, the effects are significant. For a production of 10 million units of the sensor family, the AtomSeal performance gains may generate an additional $10-$25M of value per year, where more than 80% of the total effect would come from ASP boost through the re-binning to higher-performing segments rather than pure yield gains.

With AtomSeal, we provide a breakthrough solution of atomic-level performance control to the previously ignored part of the manufacturing process. And thus create a tangible revenue generation opportunity for sensor makers.

— Erkki Seppäläinen, CEO, SisuSemi

A key advantage of the AtomSeal process is its low barrier to adoption. Initial validation is fast, low-risk and low-cost, allowing manufacturers to quantify yield improvement, performance gain and revenue impact on their own devices using post-dicing ALP™ treatment — with no front-end process changes, material substitutions or device redesign required.

The dramatic reduction in device-to-device variation translates directly into improved calibration efficiency, higher yield, better binning outcomes and enhanced long-term reliability — all achievable post-dicing on finished sensor structures.

About SisuSemi

SisuSemi is a Finnish deep-tech company based in Turku, Finland, commercializing decades of academic research from the University of Turku into atomic-level surface and interface purification. Its proprietary ALP™ technology removes atomic-scale surface defects — including oxygen, hydrogen and carbon contamination — and restores atomic order at semiconductor interfaces. SisuSemi’s systems support component-level and wafer-level treatment up to 300 mm, serving manufacturers across multiple device types, such as sensors, logic, memory, and power device segments.

Media Contact

Markku Lammassaari

CMO, SisuSemi

markku@sisusemi.com

+358400445154

www.sisusemi.com