Improving Silicon Surface Cleaning: Methods, Metrics and Best Practices

Next-Gen Atomic-level Cleaning for state-of-the-art semiconductors and sub 20nm technology Improving silicon surface cleaning is essential for enabling reliable device performance as semiconductor nodes continue to shrink. Even microscopic residues and surface imperfections can lead to interface defects, yield loss, and long-term reliability challenges. In this article, we explore next-generation atomic-level cleaning approaches that help semiconductor … Read more

Addressing Damage in Diced Sidewalls Prior to Packaging

In the world of semiconductors, ensuring that current flows precisely through the active area is essential. But what happens when it leaks through the edges? This common issue, known as leakage current, can significantly impact device performance and reliability. Sources of Leakage Current Leakage current in semiconductors generally arises from multiple sources: For example, H. … Read more

Challenges of ALD process in semiconductor manufacturing

Driven by the rising usage in the manufacturing of new and advanced chips and the growing adoption of compact or miniature devices, Atomic Layer Deposition (ALD) is one of the best methods for producing thin films. While ALD is highly effective for depositing thin films with precision, recent research has shown it has inherent challenges, … Read more

Atomic-Level Cleanliness: The Next Frontier in Semiconductor Fabrication

In recent years, awareness of surface defects has increased but not yet fully realized in the semiconductor industry. This is due to several factors, ranging from missing suitable characterization tools at fabrication lines to the lack of solutions to tackle these issues. For decades, semiconductor fabrication has focused on minimizing defects. However, as node size … Read more