PasiPietila

In the age of 5G, IoT, satellite communication, radar and next-gen wireless infrastructure, radio frequency (RF) semiconductors are at the heart of our connected world. Yet, as devices shrink and frequencies climb, the tolerances for error in RF components have all but vanished. Behind the scenes, a silent saboteur lurks: atomic-level defects and contamination. Atomic-level … Read more

As semiconductor technology continues to push the boundaries of miniaturization, 3D integrated circuits (three-dimensional, 3D ICs) are emerging as a promising solution to deliver increased performance, energy efficiency and functionality. By stacking multiple layers of circuitry vertically, 3D ICs offer significant advantages over traditional ICs in two dimensions, such as reduced interconnect distances, improved signal … Read more

In the highly competitive semiconductor industry, decisions on adopting new manufacturing technologies are complex and require validation at multiple levels. Engineers, process managers, and business leaders all play a role in evaluating the risks and benefits of any new solution before making a commitment. When it comes to atomic-level cleaning and defect reduction, potential customers … Read more

In the relentless pursuit of smaller, faster, and more powerful semiconductor devices, the industry faces an escalating challenge: atomic-level defects and contamination. These microscopic imperfections, often invisible, can have catastrophic consequences for device performance, reliability, and manufacturing yield. From a single misplaced atom to a nanometer-sized particle, these issues are the silent saboteurs of chip … Read more

In today’s increasingly competitive semiconductor landscape, foundries face mounting pressure from multiple directions. They must not only compete against other pure-play foundries for contracts from fabless companies but also against the internal fabrication capabilities of Integrated Device Manufacturers (IDMs). The market is increasingly concentrated, with the top 5 players controlling over 90% of production. As … Read more

As the semiconductor industry advances toward smaller node sizes and increasingly complex 2D structures, precise pattern control has become more critical than ever. This trend has long driven the development of high-performance dry-etching technologies that enable accurate patterning at the nanoscale. However, despite their advantages, dry-etching methods also introduce several critical challenges that continue to … Read more

Europe’s semiconductor industry accounts for less than 10% of global chip manufacturing, but it has stronger weight in key niche areas—especially automotive, industrial, aerospace, and power electronics. With leaders like Infineon, NXP, STMicroelectronics and ASML, Europe’s strength lies in specialized chips, equipment and upstream technologies. While the EU Chips Act aims to boost self-sufficiency, current … Read more

The surface quality and roughness that were still acceptable with 60nm+ linewidths become catastrophic at node sizes of 10 nm and below. With smaller nodes, transistors are mainly constructed from a surface, increasing the importance of atomic-level cleanliness and smoothness. In semiconductor fabrication, engineers have focused on minimizing defects for decades. However, as node sizes … Read more

The semiconductor industry stands at a crossroads. As demand grows for smaller, faster, and more energy-efficient chips, manufacturers face increasing pressure to eliminate atomic-level defects, reduce power consumption, and boost yields. Yet, for many IDMs, foundries, and fabless companies, achieving these goals requires more than incremental improvements—it demands a fundamental shift in mindset, processes, and … Read more