Case Study: Enhancing Chip Yield and Assembly Efficiency Through Advanced Surface Passivation
A global leader in radiation detection and safety faced critical efficiency and yield challenges during the assembly and testing phase of their neutron detector sensor chips. The indispensable wafer dicing process – whether utilizing saws or lasers – created atomic-scale defects and contamination, that introduced large variation and Signal-to-noise levels for their detector sensor chips. … Read more